关键词 |
汉高ABLESTIKJM7000导电胶 |
面向地区 |
ABLESTIK JM7000具有高可靠性，低空洞特点，耐高温可达370度。
常用超大规模集成电路封装，陶瓷焊接封装和焊接密封封装
TYPICAL PERFORMANCE OF CURED MATERIAL
Die Shear Strength:
2 X 2 mm Si die, kg-f,
cured 20 minutes @ 150ºC
Substrate DSS
Ag/Cu LF ≥5
Tensile Strength :
cured 30 minutes @ 300ºC, MPa
After Cure After 1000 TC'C"
>17 >17
Radius of Curvature:
Si die on Alumina, meters
cured 30 minutes @ 300ºC
Chip Size: ROC
15 x 15 mm > 5
ABLESTIK 5020胶膜 绝缘胶膜
广州5020胶膜 深圳汉高5020胶膜 西安ablesitk 5020胶膜 山东ablestik5020胶膜 石家庄导电胶 河北导电胶 上海导电胶
洛阳本地汉高ABLESTIKJM7000导电胶热销信息
